抄録
Mechanical strength, ductility and fracture behaviors significantly change due to a change in the size of a structure. This is the reason why mechanical characterization in relation to the structure size is necessary for materials used in micro/nano devices. Silicon crystal is the most popular material for MEMS/NEMS devices. However, those properties are still not completely clear even now. This talk summarizes characterization methods so far developed for Si as a MEMS material. Tensile test, Bending test, Bulge test, and Fatigue test methods are presented. By using such systems, it has been clarified that ductility, i.e. movement of dislocations, is enhanced by miniaturization of the structure. Fatigue properties of crystalline silicon are also started to be discussed in a room temperature environment.
