チタンMEMSのためのアルミナ絶縁層の評価

抄録

In this study, we made and evaluated an insulating layer on titanium for tough MEMS. The insulating layer was made of alumina, which has a thermal expansion coefficient close to that of titanium.We made insulating layers by using the metal organic deposition (MOD) method under atmospheric conditions. The insulating property was lost due to pinholes, but we improved it by making insulating layers multilayerd. By compareing insulating layers on 4 types of substrates, we found substrate surface confition suitable to make insulation layers. By the results of leakage current measurement, we found that the insulation resistance of arumina was more than 0.1MΩ, and it’s sufficient for MEMS device.