抄録
At the solid state bonding of aluminum die-casting alloy, it is important to remove the oxide film at the bonded interface. Focusing on the reduction reaction of oxide film at the bonded interface due to Mg in Al-Mg filler metal at the pulse electric current bonding process, the effect of type of filler metal such as powder, powder formed with polymer and sheet was investigated. The results showed that the tensile strength of the joints with powder was higher than the other type of filler. The usage of powder as filler metal increased the resistance at bonded interface and the temperature at bonded interface was higher than the other type filler. The increase in temperature at bonded interface was introduced to the improvement to quality at the joints with powder as filler metal.
