抄録
A new apparatus has been developed to fabricate micro-structures and micro-devices. The apparatus is equipped with a tungsten microprobe, a stage system, a power source of 10V-10kV and two optical microscopes for monitoring. Fine particles can be picked up, transported, arranged and, if necessary, welded one by one, In this paper, the process of manipulation and welding using the apparatus is introduced, and two examples of the application are shown. One is arrangement of polymer particles coated with solder for the flip chip, andf another is a micro conveyer actuated by the alternative magnetic field.
