抄録
This paper deals with the effect of vapor flow on heat transfer in bread during baking. Temperature, pressure and water content distributions were measured within a dough during the baking process, and enthalpy flow due to vapor flow estimated from the measured results was compared to the conductive heat transfer within the dough. The results showed that; (1) the vapor flow markedly affects the temperature distribution in the dough during baking process, (2) the enthalpy flow due to vapor flow is in the same order of magnitude as the conductive heat transfer, but the direction is opposite to each other, and (3) in the eary stage of the baking process, the outward vapor flow is weakend due to evaporation occuring in the surface region of the dough, and the convective heat transfer within the dough might be enhanced by the vapor flow during the stage.
