抄録
This paper is concerned the heat transfer analysis of electronic package. The effect of the clearance between the package substrate and the cabinet bottom surface on the thermal performance of an electronic package bonded in a model cabinet with three fans has been investigated experimentally. Two types of electronic packages have been used and the thermal resistance of package is measured by changing the height of clearance between the package substrate and the cabinet bottom. The result shows that the thermal resistance has a local minimum value corresponding to the height of clearance under the condition of strong forced convection.
