抄録
This paper describes thermal analysis of air-cooled fins for electronic equipment. Thermal analysis was carried out on the basis of thermal conduction analysis. The boundary conditions for that analysis were specified by the empirical equations developed on the basis of the results of three-dimensional laminar flow simulation. Software was developed which creates thermal conduction models of various configurations automatically. There exists appropriate design that minimizes the blowing force to realize design specified value of thermal resistance for fin.
