抄録
For the purpose of the improvement in the cooling performance of onboard water-cooled aluminum heat sink for power modules, the effects of fundamental factors such as fin configuration and materials of heat sink were examined experimentally . As the result, pin fin type newly proposed this time showed the cooling performance which was higher than the conventional plate fin type. The cooling performance was also improved of the high thermal conduction diecasting material in comparison with the general diecasting material, however, it was proven that the effect of the thermal conductivity for the cooling performancek was comparatively smaller than the effect of the fin type.
