Proceedings of thermal engineering conference
Online ISSN : 2433-1317
2001
Session ID : OS-5I/B115
Conference information
B115 Effect of Contact Angle on Wetting Limit Temperature for Water Drop
Yasuyuki TAKATASumitomo HIDAKAHiroshi YAMAMOTOTadamichi NAKAMURAMasataka MASUDATakehiro ITO
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Experimental study has been performed on evaporation of water droplet on a TiO_2-coated copper surface. The surface exhibits extremely high affinity for water by exposing the surface to ultraviolet ray and the contact angle decreases nearly to zero. Using this nature, we can change contact angle only without changing other thermal properties. The evaporation time was measured for single water droplet of four different diameters. Especially, the effect of contact angle on wetting limit temperature has been examined. It is found that wetting limit temperature increases as the contact angle decreases.
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© 2001 The Japan Society of Mechanical Engineers
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