抄録
Lead of aluminum electrolytic condenser is composed of Sn plated Fe wire (named CP wire) and pure Al wire. Those wires are welded by an arc-stud welding method. The tops of both wires are melted by arc energy and bonded by percussive pressure in this welding method. This paper deals with the microstructure of the interface of Fe/Al and the influence of Sn with the microstructure. From the results of TEM observation and LEED analysis, it was found that the intermetallic compound was formed at the interface of Fe/Al. The intermetallic compounds formed at the interface were FeAl3 and Fe2Al5. This layer thickness was less than 1.5μm. The intermetallic compounds were produced by the diffusion Fe to Al side. The intermetallic compound were not contained Sn. Sn remained at the melting area of Fe wire as the intermetallic compound with Cu. Sn was not diffuse into Al side. In case of using Sn-less Fe wire, the microstructure of the interface of Fe/Al was equivalent to that of Sn plated Fe wire. It was considered that the microstructure of the interface of Fe/Al was not influenced by Sn.
