抄録
In recent years, plane substrates and semiconductor wafers become larger year by year. Therefore, some problems occur such as fracture and stain of substrates under conventional contact transportation. In order to solve these problems, a new non-contact transportation technology is proposed in this study. The substrates are levitated by an aerostatic force and transported by the acoustic viscous force by the traveling wave of flexure stator deformation. In this paper, transportation unit with derailment prevention capability is proposed and experimental results are presented.
