抄録
In recent years, various boards such as glass substrate and semiconductor wafers have become larger. Therefore, fracture of substrates under conventional contact transportation is unavoidable. In order to solve these problems, a new non-contact transportation technology is proposed. The board is levitated by aerostatic force and held by the holding unit constructed by oscillating plate actuated by bolted Langevin transducer. In this paper, noncontact holding force was measured. The holding force is varied with overlap area between substrate and oscillating plate. As the holding units hold the substrate, the units are traveled along the transportation road. As a result, the substrate moves without any contact.
