抄録
This paper presents a novel manufacturing technology for microprobe electrode arrays which builds on our previous work using wire-bonding-based microprobe technology. Newly proposed manufacturing technology allows vertical probe structures having tips in the uniformed height. Vertical probe arrays are formed by special wire-bonding technology. The gold probes are clad by insulating materials such as photoresist. Thick photoresist pillars can be precisely patterned so as to embed and reinforce the vertical probes. Tips of electrodes are exposed and leveled by polishing. Sacrificial supporting material between pillars reinforces probes in polishing. Presented technology successfully provides an efficient method based on widespread manufacturing technologies such as wire-bonding and polishing. We could demonstrate a microprobe electrode with 100μm in height, 50μm in diameter. Reliable results of electrochemical evaluation will be also reported.
