Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : June 08, 2016 - June 11, 2016
We investigated electrical connection without soldering because materials for stretchable substrate are weak against heat. For electrical connection of an electronic component to the substrate, we proposed a method of direct bonding of an electrical component to printed wires on a polymeric ultra-film with the thickness of a few hundreds of nanometers. The electrical component is firmly bonded on the wire and we could not remove it without breaking the film. A good electrical connection was also achieved by the bonding. We revealed that the contact resistance is inversely proportional to the contact area and dependents on the surface profile.
