The Proceedings of JSME annual Conference on Robotics and Mechatronics (Robomec)
Online ISSN : 2424-3124
2023
Session ID : 2A1-E23
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Contact bump attachment and stress layer formation method for fabrication yield improvement and individual difference reduction in cantilever-based tactile sensor
*Ryota FUJITAYuki KAWASAKITakashi ABEMasayuki SOHGAWA
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Abstract

In this study, the fabrication process of the developed cantilever-based MEMS tactile sensor has been improved to increase the yield and reduce the individual differences while maintaining the force sensitivity. The bonding area between the PDMS thin layer embedding cantilever on the sensor chip and the PDMS bump as the contact point is increased and the bump is fixed using the self-adhesive property of the PDMS. As a result, the accuracy of the alignment and the reproducibility of the sensor response are improved. In addition, it is demonstrated that the fabrication process can be shortened by devising a method of forming the stress layer to generate initial deflection in the cantilevers.

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© 2023 The Japan Society of Mechanical Engineers
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