熱工学コンファレンス講演論文集
Online ISSN : 2424-290X
セッションID: D122
会議情報
D122 電子機器の熱設計における熱流体解析の現状と課題(OS-15 電子機器・デバイスの熱問題と現状技術II)
横野 泰之
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会議録・要旨集 フリー

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抄録
In order to utilize thermal analysis techniques in the actual design process, not only the thermal analysis techniques themselves, but the procedures for applying those techniques in the design, were examined According to the stage of a design, the example of application of heat fluid analysis and visualization in the thermal design of an electric equipment was divided into the system performance analysis which drops a product concept on a system function, the layout analysis which determines a system function to a part layout, and the parameter analysis which determines the design parameter of each part. The progress of the utilization technology including new analysis and visualization techniques are expected.
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© 2005 一般社団法人 日本機械学会
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