抄録
In the present paper, the similarities and differences between heat transfer technology for electronic cooling and air conditioning are discussed in order to investigate the future trends of technology evolution of liquid cooling systems. With the progress and maturation of system optimization technology, it is believed that the importance of component technology will become ever larger in the near future. Specific requirements from new applications will be the driving force for new technology evolution. With broad and deep understanding of basic principles for component technologies, it is expected that new concepts will emerge for electronic cooling devices.
