Abstract
The natural cooling capacity and flow field in relatively small electronic equipment were studied. A channel model was used as an experimental model of electronic equipment. The channel model has two vertical copper walls modeling the printed circuit boards and two transparent walls modeling the casing walls. The width between the copper walls was varied from 10mm to 15mm. Velocity distributions in the channel were quantitatively measured using a particle image velocimetry (PIV). Thermal resistance is strongly influenced by the ratio of heating energy at the walls. Velocity distributions become asymmetric depending on the channel width and the heating energy ratio.
