The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2007
Session ID : G116
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G116 Effect of metal plate barrier with holes in forced convection of electronic equipment
Masao Fujii
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Two rectangular block-like elements as an electronic module are positioned in a parallel-walled channel and cooled by forced convection airflow. A metal plate with holes as a barrier protrudes above the plane of the modules, which is intended to function as a cover for protecting them from mechanical or electromagnetic damage. Per-module heat transfer coefficients in the presence of barriers of various height, H and distance, L between the module and the barrier were measured. In the presence of the barrier with holes, the heat transfer coefficient at two modules is rapidly diminished. Nusselt numbers are correlated as a function of Reynolds number and H/L.
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© 2007 The Japan Society of Mechanical Engineers
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