抄録
A vapor chamber has been used as a heat spreader for cooling high-power small heat sources, such as CPUs in personal computers and servers. The vapor chamber is essentially a flat-plate type heat pipe and generally made of copper. In the present study, the aluminum vapor chamber is fabricated to reduce the weight. The aluminum vapor chamber is composed of two aluminum plates and a clear acrylic spacer sandwiched between them. HFE-7200 is used as the working fluid. The heat transfer characteristics of the aluminum vapor chamber are investigated, and the thermal performance is compared with the aluminum solid plate. The aluminum vapor chamber is 61 % lighter than the copper one.
