抄録
In order to realize high heat flux cooling by evaporative heat transfer in a microchannel, the bubble dynamics and heat transfer was evaluated by numerical simulation. In this study, a simulation program is developed which combined SIMPLE (Semi-Implicit method for pressure linked equation) method and VOF (Volume of fluid) technique. The bubble shape was calculated and compared with experimental results for validation. Simplified phase-change model was introduced and heat transfer process was also simulated. The film thickness and heat flux on wall boundary was evaluated and as a result, film evaporation in a 200μm microchannel may remove heat flux up to 0.6MW/m^2 according to the simulation.
