抄録
Effective thermal conductivities in thickness and in-plane directions of a printed circuit board (PCB) with highly anisotropic heat transfer nature are quite important to perform a rational thermal design of electronic equipment. Experimental study has been conducted by applying a simple evaluation method of the thermal conductivity. In this study, thermal conductivities of the glass epoxy board annd Bakelite board in in-plane direction have been evaluated by measuring the temperature distribution of the board surface by using an infrared thermometer.
