抄録
This paper describes transient heat conduction analysis for microprocessor silicon die temperature prediction using one-dimensional thermal network. Temperature gradient prediction between two different-sized objects along heat conduction paths is one of key factors to obtain calculation result with practical accuracy in transient state. This paper refers it as thermal spreading resistance and tries to investigate transient behavior of the temperature gradient between thermal grease and heat sink base by onducting three-dimensional heat conduction simulation.
