抄録
For the passive thermal management of power devices such as IGBT, GTO et al., plate-type heat pipes, 4.0mm x 40mm x 375mm, of maximum heat transport capability, Qmax, of the order of 100W, have been developed. The thermal performance in both horizontal and vertical orientations was experimentally evaluated, and outstanding thermal performance of Qmax up to 600W in the vertical orientation and thermal resistance as low as 0.01K/W were confirmed. The plate-type heat pipes were then applied to the thermal management systems for a CPU in a 1-U server and for SiC power JFET, and stable and satisfactory cooling performance of the heat pipes for the electronics devices was demonstrated.
