熱工学コンファレンス講演論文集
Online ISSN : 2424-290X
セッションID: H143
会議情報
H143 ファイバーウィッグを用いた高性能薄型ピートパイプの開発(OS-8: 電子機器・デバイスの熱課題)
アハメド モハマド シャヘッド望月 正孝斎藤 祐士
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会議録・要旨集 フリー

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抄録
In the present experimental and theoretical study, main purpose is to find out the performance limiting factors of thin heat pipe with new fiber wick structure. As the limiting factors we mainly focused on Cu pipe structure, wettability, capillary force, liquid flow area, vapor flow area and mechanical damage. In this paper, relation between the thermal performance of heat pipes with different thickness and width are showed. With the effective length of heat pipe is 125mm; maximum heat transfer capability of 0.8, 1.2, 1.5 and 2.0mm thick heat pipes are 7W, 15W, 25W, 34W and 42W respectively. Also, the theoretically achieved relation between the total pressure drop, liquid flow area and vapor flow area with different Cu pipe structure is shown.
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© 2012 一般社団法人 日本機械学会
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