抄録
A sub-channels-inserted porous evaporator is proposed as a heat sink of future power electronic devices with a heat load exceeding 300W/cm^2. This porous heat sink is attached onto the backside of a heating chip and removes the heat by evaporating cooling liquid passing through the porous medium against the heat flow. The results show that the heat transfer performance of a copper-particles-sintered porous heat sink with the sub-channels succeed in achieving a heat transfer coefficient of 9.00×104 W/m^2/K at a wall superheat of 91K against a heat flux of 816W/cm^2 and that a targeted heat flux of 300W/cm^2 is possible enough to cool at the wall superheat less than 50K.
