抄録
The present paper investigated an effect of pressure on boiling heat transfer mechanism by using the MEMS technology. Steady state pool boiling experiments were conducted by using a copper thin-film for the test heater and pure water at atmospheric condition for the test liquid. The system pressure was 0.010 and 0.10 MPa, respectively. The heaters were made of a printed circuit board and a quartz glass with sputtering copper film. The test heaters had an artificial cylindrical-cavity. The cavities were fabricated by using the MEMS technology, i.e., wet etching technology. The mechanism of critical heat flux on a single boiling bubble was examined through observations of the present experiments.
