抄録
This paper introduces a technique of iterative calculation to obtain thermal spreading resistance and thermal local resistance along heat transfer paths. First, the one-dimensional thermal network with average temperature nodes is explained. Second, a technique by iterative calculation which employs the simplified boundary conditions is introduced. After that, the effectiveness of the technique is explored by utilizing a simple model assuming a microprocessor system with heat sink fan. The calculated result is compared to a three-dimensional heat conduction simulation result. It is found that the introduced technique matches the three-dimensional heat conduction simulation result well.
