The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2015
Session ID : E124
Conference information
E124 Estimation of accuracy of measurement apparatus for thermal conductivity by using numerical simulation
Yusuke NakamuraRyota MineMakoto InoueNaoki TsujiTakahiro Ohmura
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Abstract
The comparison method of measuring thermal conductivity is simple in construction of apparatus and measurement theory. So it has been widely used to measure thermal conductivity of various kinds of materials. In this study, the contact thermal resistance between standard material and specimen was examined by using numerical simulation, when the thermal conductivity of SUS304 was measured by using copper cylinders as the standard material. The thermal conductivity of SUS304 measured by using our apparatus was lower than the reference value over 30 %. The reason of the different between measurement and reference values was explained by assuming to have respectively different thermal resistances on the contact surfaces of specimen. A dimensionless number which can show the effect of the contact thermal resistance was also derived.
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© 2015 The Japan Society of Mechanical Engineers
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