接点温度法による局所熱伝導率計測の適用条件

抄録

The purpose of this study is a development of the local thermal conductivity measurement method by contact temperature method. In this paper, the applicable conditions of this method were examined. First, by the numerical simulation of heat conduction and the measurement test for non-conductive materials coated with gold film, it was found that the proposed method with the platinum wire probe is useful for thermal conductivity of 1 to 100 W/mK. Spatial resolution of this system was also examined. It was noted the resolution for low conductivity sample is approximately 100 μm.