主催: 一般社団法人 日本機械学会
会議名: 熱工学コンファレンス2018
開催日: 2018/10/20 - 2018/10/21
This paper describes a thermal design of a combination of micro fins and vortex generators (VG) mounted in a narrow flow passage under laminar flow condition. In high-density packaging electronic equipment, in order to conduct cooling of electrical chips, miniature water cooling devices are used. In this research, the heat transfer enhancement of miniature micro fins mounted in the cooling devices by using VGs are investigated. Especially in this report, the relationship between the clearance between the fin array and the VGs and the enhancement of heat transfer efficiency was investigated through 3D-CFD analysis. It is found that the combination of VGs and micro fins are effective in order to enhance heat transfer in the narrow flow passage under laminar flow conditions.