高放熱低熱膨張基板の開発

抄録

Along with higher performance and smaller size of electronic devices, the use of high-power components and the higher density of component mounting are being promoted. When the heat generation density increases and the temperature of the mounted component rises, the component malfunctions and becomes unstable. Therefore, it is necessary to efficiently dissipate the heat generated in the component. Further, in order to secure the mounting reliability of the component, it is necessary to enhance the heat dissipation from the component and at the same time reduce the difference in thermal expansion between the component and the substrate. Therefore, we are developing a new printed circuit boards that has both high heat dissipation and low thermal expansion.