銅モリブデン複合材料を用いた高放熱低熱膨張基板の開発

抄録

With the increasing performance and miniaturization of electronic devices, the use of high-power components and the high density of component mounting are being promoted. When the heat generation density becomes high and the temperature of the mounted component rises, it leads to component failure or instability. Therefore, it is necessary to efficiently dissipate the heat generated by the component. On the other hand, in order to ensure the mounting reliability of the component, it is necessary to reduce the difference in thermal expansion between the component and the PCB(Printed circuit bord), and it is necessary to ensure heat dissipation and at the same time reduce the thermal expansion of the PCB. Therefore, we have developed a new multi-layer PCB that uses Cu-Mo composite materials and has both high heat dissipation and low thermal expansion.