シミュレーションを利用した発熱量推定に及ぼす熱干渉の影響

抄録

In the thermal design of electronic devices, power consumption of electronic components are important values. However, the useful method to estimate the value has not been reported. In our previous report, we suggested that the power consumption can be accurately estimated from the temperature of each semiconductor device, using a thermal resistance matrix obtained by heating them on a printed circuit board. In this study, to evaluate the usefulness of this method, we investigated the effect of thermal interference by simulating boards with different wiring patterns, number of thermal vias, and distance between elements, under forced cooling and natural cooling conditions.