The Proceedings of Autumn Conference of Tohoku Branch
Online ISSN : 2424-2721
2010.46
Session ID : 107
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107 Thermal history dependence of the mechanical properties of electroplated copper thin films
Fumiaki Endo, Naokazu Murata, Ken Suzuki, Hideo Miura
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Keywords: Micromechanics, Thin Film, Fatigue, Electroplated copper, Grain boundary, Micro texture
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[in Japanese]

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© 2010 The Japan Society of Mechanical Engineers
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