2012.61
Session ID : 528
Conference information
528 Development of Numerical Simulation of Elastic-Plastic Crack Extension for Evaluation of Local Interfacial Toughness in LSI Interconnects
Junya SUMIDA, Masaki OMIYA, Kozo KOIWA, Chuantong CHEN, Nobuyuki SHISHIDO, Shoji KAMIYA, Hisashi SATO, Masahiro NISHIDA, Takeshi NOKUO, Tadahiro NAGASAWA, Takashi SUZUKI, Tomoji NAKAMURA
Author information
Keywords:
LSI,
Crack extension simulation,
Local interfacial adhesion strength,
Elastic-plastic crack extension,
Fracture toughness
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