529 Trial of evaluation for the correlation between local interface strength and grain distribution on damascene interconnects

The Proceedings of Conference of Tokai Branch

Online ISSN : 2424-2748

2012.61

Session ID : 529

DOI https://doi.org/10.1299/jsmetokai.2012.61._529-1_

Conference information

529 Trial of evaluation for the correlation between local interface strength and grain distribution on damascene interconnects

Shinsuke WATANABE, Nobuyuki SHISHIDO, Shoji KAMIYA, Hisashi SATO, Kozo KOIWA, Hiroko SUGIYAMA, Chuantong CHEN, Masahiro NISHIDA, Masaki OMIYA, Takashi SUZUKI, Tomoji NAKAMURA, Tadahiro NAGASAWA, Takeshi NOKUO

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Shinsuke WATANABE
Nagoya Institute of Technology
Nobuyuki SHISHIDO
Nagoya Institute of Technology, JST
Shoji KAMIYA
Nagoya Institute of Technology, JST
Hisashi SATO
Nagoya Institute of Technology, JST
Kozo KOIWA
Nagoya Institute of Technology, JST
Hiroko SUGIYAMA
Nagoya Institute of Technology, JST
Chuantong CHEN
Nagoya Institute of Technology
Masahiro NISHIDA
Nagoya Institute of Technology, JST
Masaki OMIYA
Keio University, JST
Takashi SUZUKI
Fujitsu Laboratories Ltd.
Tomoji NAKAMURA
Fujitsu Laboratories Ltd.
Tadahiro NAGASAWA
JEOL Ltd., JST
Takeshi NOKUO
JEOL Ltd., JST

Keywords: Adhesion, Strength, Integrated Circuits, Evaluation, Interconnect, Grain distribution

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© 2012 The Japan Society of Mechanical Engineers

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