2012.61
Session ID : 530
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530 Local mechanical property evaluation of LSI copper interconnects by combining in-situ SEM nanoindentation with crystal orientation mapping by electron backscattering diffraction analysis
Keita Takazono, Nobuyuki Shishido, Shoji Kamiya, Hisashi Sato, Kozo Koiwa, Hiroko Sugiyama, Chuantong Chen, Masahiro Nishida, Masaki Omiya, Takashi Suzuki, Tomoji Nakamura, Tadahiro Nagasawa, Takeshi Nokuo
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