The Proceedings of Conference of Tokai Branch
Online ISSN : 2424-2748
2013.62
Session ID : 209
Conference information
209 Effect of Grain Size on Fatigue Properties of Electrodeposited Copper Thin Films
Shunpei TAKESHITA, Keisuke TANAKA, Hirohisa KIMACHI
Author information
Keywords: Copper, Grain size, Fatigue, Nano-crystals, Electrodeposit, Fatigue crack propagation
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (400K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2013 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top