抄録
As a fundamental study of a smart structure having the functions of crack prevention and crack closure, the temperature distributions on the surface of multiple shape memory alloy (SMA) wires embedded in epoxy resin plates and heated by supplying electric current were investigated using an infrared themography technique and finite-element method (FEM). The temperature distributions of SMA in the air and of the specimen surface obtained using FEM were in good agreement with those obtained using the themography technique. The analytical results showed that the temperature of the SMA surface embedded in the plates were less than half of those in the air.
