2017 年 66 巻 6 号 p. 427-434
A technique for efficiently selecting a metal film with strong adhesion to a resin with the combination of an orthogonal array and a response-surface method was developed to select appropriate materials for electronics devices. In this technique, at the first step, important factors that significantly influence the adhesion strength were selected from various factors that characterize metal films by use of an orthogonal array with molecular simulations. As a result, the short-side and long-side lattice constants a and b were selected from four metal-film factors (a, b, the electronegativity, E, and the surface energy density, S). At the second step, the adhesion strength was described as a function of the selected important factors by using a response-surface method. From this function, the most appropriate values for a and b that made the adhesion strength maximum were obtained. The values for a and b were obtained as 0.244 nm and 0.423 nm, respectively. At the third step, the most appropriate metal film whose lattice constants were close to a =0.244 nm and b=0.423 nm was selected by use of the data base of lattice constants. As a result, a copper/manganese/nickel-laminated film whose lattice constants were a =0.242 nm and b=0.419 nm was selected as the most appropriate metal film with the strongest adhesion to a resin.