材料
Online ISSN : 1880-7488
Print ISSN : 0514-5163
ISSN-L : 0514-5163
銅めっき法の高温領域での適応性
加藤 章
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キーワード: 応力測定, 銅めっき法, 高温
ジャーナル フリー

1978 年 27 巻 303Appendix 号 p. 1216-1219

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The author has found that the recrystallization temperature of copper plating rises considerably when a very small quantity of gelatine is added to the plating solution. In this investigation, the copper electro-plating method has been tried at high temperatures by using the plating solution with 4mg/l gelatine. The result shows that this method can be applied for stress analysis up to about 250°C.

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