材料
Online ISSN : 1880-7488
Print ISSN : 0514-5163
ISSN-L : 0514-5163
電場援用によるガラス/ガラスの接合
黒部 利次高尾 利幸市川 和浩
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1989 年 38 巻 430 号 p. 834-839

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Recently, need for excellent bonding between materials such as ceramics and semiconductors has increased remarkably in the fields of electronics and precision machinary. The bonding of glass-to-glass without any binding agent was conducted under an applied dc potential at temperatures well bellow the softening point of glass. The experiments were made in the temperature range of 210-300°C in air, on the specimens with smooth surfaces to mate closely. The experimental results showed that the bonding strength increased with increasing both the applied potential and temperature. The increase of bonded area increased the bonding strength. The bonding of glass/glass may have occurred by the electrostatic attraction associated with the movement of sodium ions in the glass under applied potential.

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