1999 年 48 巻 6Appendix 号 p. 63-73
Thin film coating by physical vapor deposition (PVD) and chemical vapor deposition (CVD) techniques are advancing intensively in the technology of mechanical as well as electrical fields. Deposition by these techniques essentially develops residual stresses in the film for intrinsic and extrinsic reasons. The microstructure of the film normally exhibits a strong preferred orientation on a crystallographic scale. Residual stresses and the microstructure of the growing film influence the properties of the film as well as the film/substrate system. The present paper demonstrates the recent developments in X-ray stress evaluation of the film having a very sharp preferred orientation. A new method of X-ray stress measurement for such films having a strong texture is presented in place of the conventional sin2Ψ method. C-axis oriented aluminum nitride (AlN) films,  fiber textured aluminum and titanium nitride (TiN) films and  fiber textured TiN films are investigated to study the residual stress and the effect of heat treatment on the state of residual stress. The effects of patterning the film on residual stress are also investigated.