コロイドプロセスによるCu内包SnO₂マイクロカプセルの合成と半導性ガラス複合体への応用

抄録

SnO₂ microcapsules containing Cu were synthesized by an interfacial reaction method using W/O type emulsion with dispersing phases including Cu spherical particles. The microcapsules with different SnO₂/Cu ratios were prepared and used as electrical conductive components of semiconductive glass composites. The effect of the SnO₂/Cu ratio on the electrical properties of the glass composite was investigated by comparing with glass composites fabricated with Cu and SnO₂ powders. The SnO₂ microcapsule with average particle size of 2.73μm was obtained. The wall of the microcapsule had about 0.65μm thickness and consisted of about 15 particle layers of fine SnO₂ particles of 0.05μm. The electrical properties of the glass composites with the SnO₂ microcapsules had small dependence on the SnO₂/Cu ratio. The glass composite with relatively small temperature dependence of electrical resistance was obtained because a good compensating effect between SnO₂ and Cu on the electrical properties of the glass composites would appear by the use of the microcapsules. On the other hand, the glass composites using SnO₂ and Cu powders had large compositional dependence of the electrical properties, and showed metallic properties at about 25vol% Cu.