抄録
For bonded dissimilar materials, the free-edge singular stress fields usually prevail near the intersection of free-surface and the interface. When two materials are bonded by welding or by using an adhesive, an interlayer or an adhesive layer may develop between two bonded materials. An interlayer may be inserted between two materials to defuse the residual stress. Stress field near the intersection of the interface and free-surface in the presence of the interlayer is then very important to evaluate the strength of bonded dissimilar materials.
In this study, to investigate the effect of the interlayer on the stress distribution on the interface, stress distributions on the interface of bonded dissimilar materials with an interlayer were calculated by using the boundary element method. Relation between the free-edge singular stress fields of bonded dissimilar materials with and without an interlayer were investigated numerically. It was found that the influence of the interlayer on the stress distribution was limited within a small area of the order of interlayer thickness around the intersection of the interface and the free-surface when the interlayer is very thin. Stress distribution near the intersection of the interface and free-surface was controlled by the free edge stress singularity of the bonded dissimilar materials without the interlayer. The interlayer in this condition can be called free-edge singularity controlled-interlayer.
