抄録
With the evolution of power device elements, there is a demand for bonding materials that can bond devices with low thermal
stress and realize high heat resistance bonding that supports high temperature operation. We propose a new bonding material that
achieves high heat resistance in a low-temperature, short-time process by using metal fine particles and based on the characteristics
of fine particles and the concept of liquid-phase diffusion bonding. In this study, we investigated the relationship between the metal
composition in the bonding material and the bonding strength for bonding materials using SnBi and Cu, and reported that the particle
structure affects the formation of the bonding layer.
