抄録
We investigated a method of copper plating on glass substrates wit h high smoothness and insulation properties and excellent
transmission characteristics, while maintaining the smoothness of the substrate. The tin oxide deposited by the liquid phase
deposition method acts as an adhesion layer between the glass substrate and the plating film, which was obtained to copper plating
film with excellent adhesion. In this report, we discuss the microstructure of the plating film interface where high adhesion is
obtained.
