抄録
We have tech nology to manufacture copper nanoparticles by dry process. In this study, we investigated the basic characteristics of
transfer bonding sheet using our copper nanoparticles with the goal of developing transfer bonding sheet that can be transferred to
the same size as SiC and can be bonded at low temperature （250℃ or less）. As a result, transfer bonding sheet with shear strength
of 70 MPa or more was produced under the bonding conditions of 250℃, 10 MPa and 5 min in nitrogen atmosphere.
