A Comparative Numerical Study of Thermo-Mechanical Behavior among Various IMC Joints under Thermal Cycling Condition

抄録

 The utilization of transient liquid phase bonding has rendered numerous intermetallic compounds (IMCs) employed as die-attach joints in wide band gap power modules. However, the distinct thermo-mechanical behavior of these IMC joints under thermal cycling conditions has not been investigated. In this study, a comparative study of the thermo-mechanical behavior of six categories IMC joints: Ni₃Sn₄, Ag₃Sn, Cu₆Sn₅, Cu₃Sn, Ag₉In₄, and Ag₃In under thermal cycling conditions were studied through finite element modelling analysis. The thermal stress that induced in IMC joint, and thermal stress/accumulated plastic strain in SiC/direct bonding copper (DBC) were specifically investigated. The results revealed a clear hierarchy among these IMCs concerning their suitability for die attachment when considering thermal cycling conditions. Notably, the Ag₃Sn joint emerged as the most promising choice due to the lowest induced thermal stress within the IMC layer and less damage on SiC/DBC. Conversely, Ni₃Sn₄ exhibits the least favorable thermos-mechanical behavior among the IMCs.